Line scan rates above 1 MHz
Based on the image capture with the AIT xposure:1M technology, for example, microprinting on banknotes can still be precisely recognized even at high capture speeds. Image source: AIT Austrian Institute of Technology
Imaging Solutions for Semiconductor Wafer and Chip Inspection
High resolution up to 245MP, high speeds, and imaging beyond the visible spectrum. Our high-performance camera portfolio meets the most demanding requirements in semiconductor manufacturing.
Wafer and Chip Inspection
Semiconductor manufacturing places the highest demands on inspection systems: maximum precision, sensitivity, and reliability. High-end cameras ensure to detect defects early on, enable process control down to the nanometer range and help to increase yield. Whether for wafer or chip inspection in a single shot, microscopic defect detection, or precise alignment during bonding, every application requires a specialized camera solution.
Achieving the perfect balance of image quality and robust performance is crucial. Depending on the application, this means SWIR technology for highly accurate defect detection within the material and ultra-high resolutions for large field of view inspections. The key to success is the right camera technology—tailored to accuracy, throughput, and long-term stability.
That's what matters
While macro inspections require high-end cameras with ultra-high resolutions, microscanning and chip inspection benefit from global shutter sensors with high speed and precise triggering. SWIR cameras are indispensable for subsurface inspections and bonding applications, as they reveal structures inside of the material that remain hidden to standard sensors.
Equally important is the balance between throughput and reliability. Modern high-bandwith interfaces such as CoaXPress, 10GigE, 25GigE and 100GigE ensure stable, low-latency data transmission. Advanced features such as pixel defect correction, non-uniformity correction (NUC), and optimized cooling guarantee the highest image quality. The result: defects are detected with high sensitivity, and highly accurate inspection systems are seamlessly integrated into semiconductor production lines.
Typical fields of application & suitable cameras
Macro Wafer Inspection
SHR - Super High Resolution
- up to 245 MP resolution
- Sony CMOS sensors with rolling and global shutter
- advanced image optimization, defect pixel and lens shading correction
- CoaXPress and 10GigE interface
Micro Wafer Scanning Inspection
FXO
- 1.8 - 24.6 MP resolution in a compact housing with C-mount
- Sony CMOS sensors with global shutter
- Advanced image optimization, pixel error correction, and shading correction
- 10GigE, 25GigE, 100GigE and CoaXPress-12 interface
- Frame rates up to 671 fps
Sub-surface Inspection and Wafer/Chip Bonding Alignment
FXO SWIR
- Resolutions up to 5.2MP
- Sony SenSWIR sensor with 400-1700nm spectral sensitivity and high quantum efficiency
- Advanced dynamic image optimization including advanced two-point NUC, pixel error correction, and shading
- 10GigE and CoaXPress-12 interface
- TEC and TECless options
Case Studies
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